Recommended Determination on Remedy and Bonding
ALJ Essex issued an initial determination on violation of section 337 and a recommended determination on remedy and bonding in Inv. No. 337-TA-630, In the Matter of Certain Semiconductor Chips with Minimized Chip Package Size and Products Containing Same. ALJ Essex held that no violation of section 337 has occurred. The products at issue do not literally infringe the asserted claims of U.S. Pat. Nos. 5,679,977 and 6,133,627, nor do they infringe under the doctrine of equivalents U.S. Pat. No. 5,663,106. The ALJ also found that all three patents were not invalid for anticipation, obviousness, or indefiniteness and that a domestic industry exists. (PDF)
